Lightwave Logic Announces Availability Of Its High-Speed Modulator Platform As Part Of GDSFactory Process Design Kit

Lightwave Logic, Inc. (NASDAQ:LWLG) ("The Company"), a technology platform company leveraging its proprietary electro-optic (EO) polymers to transmit data at higher speeds with less power in a small form factor, today announced that its high-speed modulator platform is now available as part of the GDSFactory process design kit (PDK) supporting GlobalFoundries' (GF) silicon photonics manufacturing platform.

Lightwave Logic and GDSFactory have collaborated to integrate Lightwave Logic's polymer-based modulator technology into the GDSFactory PDK, enabling customers to incorporate high-speed electro-optic polymer modulators directly into their photonic integrated circuit (PIC) designs for tape-out on GF's silicon photonics platform. The expanded PDK and integrated design flow supports simulation, verification, and fabrication handoff within the GDS Factory environment, providing a manufacturable pathway from design to foundry execution.

GDSFactory and Lightwave Logic have recently launched a new tape-out to validate the performance of the PDK-integrated modulator platform, and further tape-outs are tentatively scheduled later in 2026 to support potential customer designs. These validation runs are designed to demonstrate high-speed modulator architectures targeting 200G and 400G per lane applications, with a focus on low power consumption and scalability for data center, AI acceleration, and other high-performance photonic systems.