MALVERN, Pa., April 29, 2026 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today announced its new thin film submount platform, designed to support next-generation optical transceivers, RF modules, and advanced electronic packaging applications requiring high thermal performance, precision alignment, and high frequency signal integrity.
Read more at globenewswire.comVishay Specialty Thin Film Introduces Thin Film Metallized Submount Platform
Barchart·04/29/2026 10:49:00
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