Lightwave Logic posts presentation on electro-optic polymer reliability for high-speed silicon photonics modulators

• Lightwave Logic outlined reliability milestones for its electro-optic polymer platform targeting high-speed silicon photonics modulators for AI connectivity.
• Reported more than 2,000 hours of damp-heat stress testing in data center-like heat and humidity, citing performance stability above industry standards.
• Set a reliability target of negligible de-poling at 85°C continuous operation, citing poled polymer r33 above 150 pm/V at 100 V/um fields.
• Positioned encapsulation as critical to oxygen-driven photodegradation, citing thin-film tests showing under 2% degradation over 1,000 hours for one material.
• Reiterated readiness for 400Gb/s device development, framing polymers, processes, and designs as compatible with CMOS-scale silicon photonics manufacturing.

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