Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the availability of complete client chipsets for next-generation AI PC memory modules, featuring two new Power Management ICs (PMICs) for client computing. PMICs are critical to efficiently power memory modules providing breakthrough levels of performance for advanced computing applications. The two new Rambus industry-leading PMICs are the PMIC5200, for LPDDR5 CAMM2 (LPCAMM2) memory modules and the PMIC5120, which supports DDR5 CSODIMMs and CUDIMMs.
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LPCAMM2 Memory Module with Rambus PMIC and SPD Hub ICs
These PMICs, alongside the Client Clock Driver (CKD) and Serial Presence Detect Hub (SPD Hub), comprise a complete chipset offering to enable memory modules for AI PC notebooks, desktops and workstations. Further, with the addition of these new PMICs, Rambus now offers complete memory interface chipsets for all JEDEC standard DDR5 and LPDDR5 memory modules for both servers and clients.
“The proliferation of AI-enabled client systems is driving new memory subsystem requirements that demand modules delivering higher bandwidth and optimized power efficiency,” said Rami Sethi, SVP and general manager of Memory Interface Chips at Rambus. “Having established a leadership position with the introduction of our DDR5 server PMIC family, we’re now extending that leadership with two client PMICs that round out a complete DDR5 and LPDDR5 client memory module chipset, which also includes our Client Clock Driver and SPD Hub. Our memory interface chipsets, for LPCAMM2 and DDR5 CUDIMMs and CSODIMMs, enable our customers to address the broad range of form factor, capacity and bandwidth options required by this next wave of exciting AI PC platforms.”
“Micron’s first-to-market leadership in LPCAMM2 technology is advancing computing performance in AI PCs while disrupting the industry with unprecedented modularity and flexibility,” said Ross Dermott, vice president of mobile product line management in Micron’s Mobile and Client Business Unit. “Rambus’ latest PMIC solutions are a critical component in our next-generation LPCAMM2 modules — allowing us to push the boundaries of memory performance and strengthen our gen-over-gen LPCAMM2 industry leadership.”
“AI PCs powered by Intel processors ushers in a new era of productivity, creativity and entertainment experience. The latest Intel® Core™ Ultra processors family features cutting-edge AI enhancements, increased efficiency and performance improvements,” said Dimitrios Ziakas, VP of Memory & IO Technologies, Intel Corporation. “From ultra-thin notebooks to the most powerful workstations, Rambus memory interface chips can support the multitude of form factors both businesses and consumers will employ to harness the power of AI.”
“As the rapid evolution of AI reshapes the PC market, the demands on memory bandwidth and capacity will only accelerate,” said Brandon Hoff, executive analyst at IDC. “High-performance LPDDR5 and DDR5 memory modules, enabled by advanced memory interface chipsets, will be key to unlocking the tremendous possibilities of AI.”
As data rates continue to rise to support the needs of AI and other advanced workloads, signal integrity (SI) and power integrity (PI) management become increasingly vital. With 35 years of high-performance memory experience, Rambus is renowned for its SI/PI expertise. This expertise helps enable DDR5 and LPDDR5 memory interface chips to deliver superior signal integrity and power efficiency at higher performance for server and client DIMMs.
To deliver the highest levels of performance and reliability, Rambus offers complete memory interface chipsets for all JEDEC standard DDR5 and LPDDR5 memory modules, including:
- LPCAMM2 Chipset: PMIC5200, SPD Hub
- DDR5 CSODIMM and CUDIMM Chipset: Client Clock Driver (CKD), PMIC5120, SPD Hub
- DDR5 RDIMM 4800 – 8000 Chipsets: Registering Clock Driver (RCD), PMIC, Serial Presence Detect Hub (SPD Hub), Temperature Sensor ICs (TS)
- DDR5 MRDIMM 12800 Chipset: Multiplexing Registering Clock Driver (MRCD), Multiplexing Data Buffer (MDB), PMIC, SPD Hub, TS
Join Us at COMPUTEX:
Rambus will be at COMPUTEX 2025 in Taipei sharing the latest information on the LPDDR5 and DDR5 Client DIMM chipsets. Reach out to schedule a meeting with our memory interface chip experts here.
More Information:
Learn more about the Rambus DDR5 and LPDDR5 Client DIMM Chipsets here.
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Company website: rambus.com
Rambus blog: rambus.com/blog
LinkedIn: www.linkedin.com/company/rambus
About Rambus Inc.
Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With 35 years of advanced semiconductor experience, we are a pioneer in high-performance memory solutions that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world’s data needs and drive ever-greater end-user experiences. For more information, visit rambus.com.
Source: Rambus Inc.
Forward-looking statements
Information set forth in this press release, including statements as to Rambus’ outlook and financial estimates and statements as to the expected timing and effects of Rambus products, constitute forward-looking statements within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995.
These statements are based on various assumptions and the current expectations of the management of Rambus and may not be accurate because of risks and uncertainties surrounding these assumptions and expectations. Factors listed below, as well as other factors, may cause actual results to differ significantly from these forward-looking statements. There is no guarantee that any of the events anticipated by these forward-looking statements will occur, or what effect they will have on the operations or financial condition of Rambus. Forward-looking statements included herein are made as of the date hereof, and Rambus undertakes no obligation to publicly update or revise any forward-looking statement unless required to do so by federal securities laws.
Major risks, uncertainties and assumptions include, but are not limited to: any statements regarding anticipated operational and financial results; any statements of expectation or belief; other factors described under “Risk Factors” in Rambus’ Annual Report on Form 10-K and Quarterly Reports on Form 10-Q; and any statements of assumptions underlying any of the foregoing. It is not possible to predict or identify all such factors. Consequently, while the list of factors presented here is considered representative, no such list should be considered to be a complete statement of all potential risks and uncertainties.
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